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Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules

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Author

Publishing year

2009

Language

English

Document type

Conference paper

Topic

  • Electrical Engineering, Electronic Engineering, Information Engineering

Conference name

<em>DATE 2009 Friday Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Tes</em>

Conference date

2009-04-20 - 2009-04-24

Conference place

t, Nice, France

Status

Published