Measurement Point Selection for In-Operation Wear-Out Monitoring

Summary, in English

In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wearout monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.

• Author: Urban Ingelsson; Shih-Yen Chang; Erik Larsson
• Publishing year: 2011
• Language: English
• Publication/Series: 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11)
• Links: http://dx.doi.org/10.1109/DDECS.2011.5783115
• Document type: Conference paper
• Topic: Electrical Engineering, Electronic Engineering, Information Engineering
• Conference name: 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11)
• Conference date: 2011-04-13 - 2011-04-15
• Status: Published
• ISBN/ISSN/Other: ISBN: 978-1-4244-9755-3