Scheduling Tests for 3D Stacked Chips under Power Constraints
Author
Summary, in English
Publishing year
2011
Language
English
Pages
72-77
Publication/Series
2011 Sixth IEEE International Symposium on Electronic Design, Test and Application
Full text
- Available as PDF - 365 kB
- Download statistics
Document type
Conference paper
Publisher
IEEE - Institute of Electrical and Electronics Engineers Inc.
Topic
- Electrical Engineering, Electronic Engineering, Information Engineering
Keywords
- Design for Test (DfT)
- Built in Self Test (BIST)
- Test scheduling
- Sessions
- Test time
- Test cost
- 3D Stacked Integrated Circuit (SIC)
- Through Silicon Via (TSV).
Conference name
6th International Symposium on Electronic Design, Test and Applications (DELTA 2011)
Conference date
0001-01-02
Conference place
Queenstown, New Zealand
Status
Published
Research group
- Digital ASIC
ISBN/ISSN/Other
- ISBN: 978-1-4244-9357-9