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Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

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Author

Department/s

Publishing year

2016

Language

English

Publication/Series

Proseeding to the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

Document type

Conference paper

Topic

  • Applied Mechanics

Conference name

8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

Conference date

2016-06-27 - 2016-06-29

Conference place

Brno, Czech Republic

Status

Published

Project

  • Modelling mechanical properties at nanoscale by molecular dynamics
  • Peridynamic modeling of materials