Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules
Author
Publishing year
2010
Language
English
Publication/Series
Design & Test Symposium (EWDTS), 2010 East-West
Document type
Conference paper
Topic
- Electrical Engineering, Electronic Engineering, Information Engineering
Conference name
IEEE East-West Design and Test Symposium (EWDTS10)
Conference date
2010-09-17 - 2010-09-20
Conference place
St. Petersburg, Russian Federation
Status
Published
ISBN/ISSN/Other
- ISBN: 978-1-4244-9555-9