The browser you are using is not supported by this website. All versions of Internet Explorer are no longer supported, either by us or Microsoft (read more here: https://www.microsoft.com/en-us/microsoft-365/windows/end-of-ie-support).

Please use a modern browser to fully experience our website, such as the newest versions of Edge, Chrome, Firefox or Safari etc.

Laminar thermal performance of microchannel heat sinks with constructal vertical Y-shaped bifurcation plates

På svenska

Author

Summary, in English

With increasing output power of integrated chips, the involved heat flux is accordingly increased. Traditional cooling methods failed to satisfy such a situation, and thus new cooling methods incorporating microchannel heat sinks with high capabilities of heat removal are necessary. In this paper, on the basis of a water-cooled smooth microchannel heat sink, vertical Y-shaped bifurcation plates are designed into the heat sink, and then the corresponding laminar flow and heat transfer are investigated numerically. Four different configurations of Y-shaped plates are considered by adjusting the angle between the two arms of the Y profile. The effects of the angle on heat transfer, pressure drop, and the thermal resistance are also observed and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall resistances subjected to inlet Reynolds number and pumping power are also compared for the five microchannel heat sinks. The results show that the thermal performance of the microchannel heat sinks with Y-shaped bifurcation plates is much better than that of the corresponding straight channel. It is suggested that the Y-shaped bifurcation plates placed in water-cooled microchannel heat sinks could improve the overall thermal performance when the angle between the two arms of the Y-shaped plates is designed properly. (C) 2014 Elsevier Ltd. All rights reserved.

Department/s

Publishing year

2014

Language

English

Pages

185-195

Publication/Series

Applied Thermal Engineering

Volume

73

Issue

1

Document type

Journal article

Publisher

Elsevier

Topic

  • Energy Engineering

Keywords

  • Microchannel heat sink
  • Y-shaped plates
  • Bifurcation flow
  • Laminar heat
  • transfer
  • CFD

Status

Published

ISBN/ISSN/Other

  • ISSN: 1359-4311