Electrical Characterization and Modeling of Gate-Last Vertical InAs Nanowire MOSFETs on Si
Author
Summary, in English
Vertical InAs nanowire transistors are fabricated on Si using a gate-last method, allowing for lithography-based control of the vertical gate length. The best devices combine good ON- and OFF-performance, exhibiting an ON-current of 0.14 mA/μm, and a sub-threshold swing of 90 mV/dec at 190 nm LG. The device with the highest transconductance shows a peak value of 1.6 mS/μm. From RF measurements, the border trap densities are calculated and compared between devices fabricated using the gate-last and gate-first approaches, demonstrating no significant difference in trap densities. The results thus confirm the usefulness of implementing digital etching in thinning down the channel dimensions.
Department/s
Publishing year
2016-08-08
Language
English
Pages
966-969
Publication/Series
IEEE Electron Device Letters
Volume
37
Issue
8
Full text
- Available as PDF - 727 kB
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Document type
Journal article (letter)
Publisher
IEEE - Institute of Electrical and Electronics Engineers Inc.
Topic
- Electrical Engineering, Electronic Engineering, Information Engineering
Keywords
- vertical
- nanowire
- InAs
- MOSFET
- transistor
- gate-last
- self-aligned
Status
Published
Research group
- Nano Electronics
ISBN/ISSN/Other
- ISSN: 0741-3106