The browser you are using is not supported by this website. All versions of Internet Explorer are no longer supported, either by us or Microsoft (read more here: https://www.microsoft.com/en-us/microsoft-365/windows/end-of-ie-support).

Please use a modern browser to fully experience our website, such as the newest versions of Edge, Chrome, Firefox or Safari etc.

Effect of surfactant structure on the pasting properties of wheat flour and starch suspensions

Author

  • I Mira
  • Ann-Charlotte Eliasson
  • K Persson

Summary, in English

Systematic studies were performed on the effect of the surfactant alkyl chain length (10-16 carbon atoms) and the head group charge/structure (anionic, cationic, nonionic) on the pasting properties of wheat flour and starch aqueous suspensions by means of a Rapid Visco Analyser (RVA). An excellent agreement was observed between the effect of surfactants on the onset temperature of the pasting process (PT) and the time to reach peak viscosity (t(peak)) of wheat flour and wheat starch suspensions. Moreover, a correlation was found between the effect of different surfactants on these two parameters. With the exception of the cationic surfactants (alkyl trimethyl ammonium bromides), the effect of surfactants (alkyl sulfates, maltosides, monoglycerides, and sucrose esters) was found to be strongly dependent on the surfactant chain length. Shorter chain surfactants (C10-C12) induced an earlier pasting, while longer chain surfactants (C14-C16) had the opposite effect. The effect of surfactants on PT and t(peak) of flour suspensions was enlarged when the surfactant concentration was increased from approximate to1% to 15% (w/w) on a dry starch basis.

Department/s

  • Department of Food Technology, Engineering and Nutrition

Publishing year

2005

Language

English

Pages

44-52

Publication/Series

Cereal Chemistry

Volume

82

Issue

1

Document type

Journal article

Publisher

American Association of Cereal Chemists

Topic

  • Food Engineering

Status

Published

ISBN/ISSN/Other

  • ISSN: 0009-0352