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Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics

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Author

Summary, in English

A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin film between two stiff layers. The Lennard Jones pair potential is used for the inter-atomic forces. The centrally placed crack-shaped void is created by removing a few atoms inside the strip. The crack is loaded perpendicular to the crack plane and the variation of the tensile stress is studied. Also the elastic response for an uncracked strip is simulated using the same loading conditions. Comparisons with finite element (FE) calculations are made and the aim is to find a limit in model size beneath which the FE solutions and linear elastic fracture mechanics (LEFM) lose their accuracy. (C) 2013 Elsevier Ltd. All rights reserved.

Department/s

Publishing year

2014

Language

English

Pages

58-68

Publication/Series

Engineering Fracture Mechanics

Volume

116

Document type

Journal article

Publisher

Elsevier

Topic

  • Applied Mechanics

Keywords

  • Molecular dynamics simulations
  • Lennard-Jones
  • Fracture mechanics

Status

Published

Project

  • Atomistic Studies of Nanosized Copper Structures

ISBN/ISSN/Other

  • ISSN: 1873-7315