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Optical Link by Using Optical Wiring Method for Reducing EMI

Author

  • In-Kui Cho
  • Jong-Hwa Kwon
  • Sung-Woong Choi
  • Alexander Bondarik
  • Je-Hoon Yun
  • Chang-Joo Kim
  • Seung-Beom Ahn
  • Myung-Yung Jeong
  • Hyo Hoon Park

Summary, in English

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy

assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and

susceptibility.

This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the

following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a

substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring

link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)

directly connecting one end of the surface-finished optical transmission connection medium with the light source device

and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such

as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-

electronics), the purely optical part and optical link(interconnection) is free of these problems. 1

An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and

EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust

and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data

transmission rate without EMI problems.

Publishing year

2008

Language

English

Publication/Series

[Host publication title missing]

Volume

7268

Document type

Conference paper

Publisher

SPIE

Topic

  • Electrical Engineering, Electronic Engineering, Information Engineering

Keywords

  • Interconnect
  • electromagnetic interference
  • chip-to-chip interconnection
  • metal electro-optical bench(MOB)
  • optical interconnection technology
  • Plastic optical fiber(POF)
  • EMI

Conference name

Smart Structures, Devices, and Systems IV

Conference date

2008-12-09

Conference place

Melbourne, Australia

Status

Published

Research group

  • Electromagnetic theory

ISBN/ISSN/Other

  • ISBN: 9780819475206