Nanoimprint technology for fabrication of three-terminal ballistic junction devices in GaInAs/InP
Author
Summary, in English
We present processing technology based on nanoimprint lithography (NIL) and wet etching for fabrication of GaInAs/InP three-terminal ballistic junction (TBJ) devices. To transfer sub-100 nm features into a high-mobility InP-based 2DEG material, we used SiO2/Si stamps made with electron beam lithography and reactive ion etching. After the NIL, the resist residues are removed in oxygen plasma followed by wet etching of GaInAs/InP to define the M-structures. Fabricated TBJ-devices are characterized using scanning electron microscopy and electron transport measurements. Highly non-linear electrical characteristics of the TBJ structures are demonstrated and compared with E-beam defined devices. (C) 2003 Elsevier Science B.V. All rights reserved.
Department/s
Publishing year
2003
Language
English
Pages
196-202
Publication/Series
Microelectronic Engineering
Volume
67-8
Document type
Journal article
Publisher
Elsevier
Topic
- Condensed Matter Physics
Keywords
- nanoimprint lithography
- GaInAs/InP
- three-terminal ballistic junction
Status
Published
ISBN/ISSN/Other
- ISSN: 1873-5568