The browser you are using is not supported by this website. All versions of Internet Explorer are no longer supported, either by us or Microsoft (read more here: https://www.microsoft.com/en-us/microsoft-365/windows/end-of-ie-support).

Please use a modern browser to fully experience our website, such as the newest versions of Edge, Chrome, Firefox or Safari etc.

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

På svenska

Author

Summary, in English

This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided.

Department/s

Publishing year

2014

Language

English

Publication/Series

Journal of Electronic Packaging

Volume

136

Issue

2

Document type

Journal article

Publisher

American Society Of Mechanical Engineers (ASME)

Topic

  • Energy Engineering

Keywords

  • thermal resistance network
  • electronic chips
  • air-cooling
  • offset strip
  • fin
  • local temperature

Status

Published

ISBN/ISSN/Other

  • ISSN: 1043-7398