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Forming performance of liquid board packages; corner fold development

På svenska

Author

Summary, in English

The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.

Department/s

Publishing year

2007

Language

English

Pages

217-221

Publication/Series

[Host publication title missing]

Document type

Conference paper

Publisher

Appita

Topic

  • Mechanical Engineering

Keywords

  • FE simulations
  • Liquid board
  • package forming
  • corner folds

Conference name

International Paper Physics Conference

Conference date

2007-05-06 - 2007-05-10

Conference place

Gold Coast, Australia

Status

Published

ISBN/ISSN/Other

  • ISBN: 9780975746928