The browser you are using is not supported by this website. All versions of Internet Explorer are no longer supported, either by us or Microsoft (read more here: https://www.microsoft.com/en-us/microsoft-365/windows/end-of-ie-support).

Please use a modern browser to fully experience our website, such as the newest versions of Edge, Chrome, Firefox or Safari etc.

Stress analysis around a through crack in a thin copper film using molecular dynamics

På svenska

Author

Department/s

Publishing year

2012

Language

English

Pages

094-094

Document type

Conference paper

Topic

  • Applied Mechanics

Conference name

4th International Conference on Crack Paths -CP2012

Conference date

2012-09-19 - 2012-09-21

Conference place

Gaeta, Italy

Status

Published