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Tensile Behavior of Single-crystal Nanosized Copper Beams with Voids

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Author

Summary, in English

The tensile response under displacement controlled loading of nanosized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.

Department/s

Publishing year

2017

Language

English

Pages

53-56

Publication/Series

Solid State Phenomena

Volume

258

Document type

Journal article

Publisher

Trans Tech Publications

Topic

  • Applied Mechanics

Keywords

  • MD simulation
  • Single crystal Cu
  • Tensile strength
  • Void size effects
  • Voids in nano-beams

Status

Published

Project

  • Modelling mechanical properties at nanoscale by molecular dynamics

ISBN/ISSN/Other

  • ISSN: 1012-0394